Thermomechanical simulation of electronic hardware
To ensure the reliability of electronics as early as the design stage, thermomechanical simulation is becoming an increasingly important tool. Swerim provides expertise and services in thermomechanical simulation.
This method is important for increasing knowledge of thermomechanical mechanisms and of how failure mechanisms can affect electronic hardware.
Preventing faults and cracks
In modern electronics, such as in plastic encapsulated components, a number of different materials are used with widely ranging thermal expansion coefficients. During the manufacturing process and during use – especially in demanding operating environments – the surfaces between silicon chips and moulded plastics, for example, are subjected to heavy mechanical loads.
By using thermomechanical simulation, failures and cracking can be predicted that in the worst case could jeopardise electrical functions.